3D Interconnects for System In Package (SiP)
Aerosol Jet's high velocity dense mist stream enables the system to print vertically along the terraced steps of stacked dies without having to adjust Z-height positioning for eight to sixteen SiP die stacks. Typical 3D interconnects are 25 to 30 microns wide by 5+ microns in height. Total length of the interconnects are approximately 1.5mm long with throughput for a single nozzle reaching up to 5,000 interconnects per hour. The Aerosol Jet print head is highly scalable supporting 2, 3, 5, or more nozzles at a time, pitch dependent, enabling throughputs as high as 25,000 or more interconnects per hour. The print head is equipped with a mechanical shutter for rapid on/off of the print stream and is capable of extended print runtimes of twelve hours or more before ink refill is required. For more information click here to access a IMAPS paper on "Aerosol Jet Printing of High Density, 3-D Interconnects for Multi-Chip Packaging"

Printing in Trenches and on Domes
The demand for novel consumer and military electronic devices that pack more functionality into less space is driving development of 3D printed electronics. Applications ranging from System In Package (SiP) used in smart phones and other mobile devices to conformal printed sensors, antennae and EMI shielding used in aerospace and defense products, are all realizing the possibilities of Aerosol Jet conformal printing technology. The unique ability of Aerosol Jet systems to print fine line conformal circuitry on non planar surfaces is a key enabler for fully printed electronics on 3D surfaces. The relatively large stand-off, up to 5mm from the nozzle tip to the substrate, and high velocity particle stream enable the Aerosol Jet material deposition head to print on surfaces with inclines of up to 60 degrees without tilting the head. Printing on higher inclined surfaces can be achieved by tilting the Aerosol Jet print head. Customers have adapted our systems to their specific printed electronics requirements by adding four or five axes of motion along with specific tilt head control

Sensors and Other Printed Electronic Conformal Devices
The demand for novel consumer and military electronic devices that pack more functionality into less space is driving printed sensors and other printed electronic conformal devices. The unique ability of Aerosol Jet technology to print a wide variety of electronic materials directly onto a wide variety on non-planar surfaces makes it an ideal solution for many Aerospace and Defense applications. The system can deposit conductor, dielectric, resistor, and semiconductor materials used to print conformal sensors, antennae, EMI shielding and other active and passive components. Benefits of printing conformal electronic devices include reduce weight and size, reduced aerodynamic drag by eliminating protruding components, and reduced cost by integrating the components during the fabrication of the composite structure.

The Aerosol Jet system was used to print a conformal sensor, antenna and circuitry directly onto the wing of a UAV model. The wing was 3D printed with the Stratasys Fused Deposition Modeling (FDM) process. The electrical and sensor designs were provided by Aurora Flight Sciences, a supplier of UAVs.

3D Printing with Aerosol Jet
Neotech Services, Optomec's representative in the EU, implemented a 6-axis 3D printing system utilizing Aerosol Jet technology. With this development, Neotech aims to extend Aerosol Jet's unique capabilities towards true 3D Printed Electronics. The installed system can print over complex conformal surfaces and will be used to develop integrated sensor, MID circuit and smart structure applications. The target markets are automotive, industrial and aerospace industries.

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