Aerosol Jet System Configurations

Aerosol Jet systems are ideally suited to develop, fabricate, enhance and repair high performance electronic and biologic devices for Consumer Electronics, Semiconductor Packaging, Displays, Aerospace/Defense, Automotive and Life Sciences end use products. The Aerosol Jet process cost effectively prints high resolution electronic circuits and components on 2D and 3D surfaces from a wide range of materials including conductive nano-particle metal inks, dielectric pastes, semiconductor and other functional materials.

Aerosol Jet 200 Series Systems are ideally suited for universities, ink developers, and others exploring the benefits of additive manufacturing for electronic applications.

aerosol_jet_200

Optional Features

  • One Pneumatic Atomizer with heater/stirrer
  • Swappable Wide Feature Head with Shutter
  • Manual Tilt for Fine Feature Head

Standard Features

  • Work area 200mm x 200mm
  • X,Y motion +/- 25 microns accuracy
  • One Ultrasonic Atomizer
  • Fine Feature Head with Shutter
  • Heated Vacuum Platen
  • System and Process Control Software
  • Tool Path Generation Software

Applications

Aerosol Jet 200 series systems provide a professional grade, compact benchtop print solution specifically developed for printing electronics. Example applications for the Aerosol Jet 200 Series include:

  • Curriculum development and delivery
  • Development of new inks and other materials
  • Print process development
  • New product development
  • Advanced biologics R&D

Print Capabilities

  • Fine Feature sizes to 10um
  • Wide Features Sizes to 1.5mm
  • Thin layer deposits from 100nm
  • Many inks and substrates
  • Ink viscosity range from 1-7 cP (Standard)
  • Ink viscosity range from 1-1000 cP (with Pneumatic Atomizer)
  • Planar and Non-Planar Capabilities
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Aerosol Jet 200 Datasheet

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Aerosol Jet 300 Series systems are ideally suited to develop next generation processes and devices for photovoltaic, touch screen displays, 3D interconnects and other printed electronics and biologics applications. A number of Aerosol Jet 300 Series system configurations are available to meet your specific application requirements.

AJ-300-System

Optional Features

  • Optional 700 mW Laser or UV Cure Systems
  • Swappable Wide Feature Head with Shutter
  • Manual Tilt for Fine Feature Head
  • Motorized Z” to options list

Standard Features

  • Work area 300mm x 300mm
  • XY motion system +/- 6 micron accuracy
  • Two Atomizers
  • Fine Feature Deposition Head with Heater & Shutter
  • Heated Vacuum Platen
  • System and Process Control Software
  • Tool Path Generation Software
  • Stainless Steel Cabinet with Granite Table Top
  • Safety Enclosure (CE)

Applications

Workhorse platform for general material science R&D and low-volume fabrication of electronic circuitry and components. Also ideal for product development, prototyping and life sciences research. Example applications include:

  • 3D Interconnects for multi-chip packages
  • Embedded passives
  • Printed sensors and antennas on conformal surfaces
  • Bio fabrication

Print Capabilities

  • Fine Feature sizes to 10 um
  • Wide Features Sizes to 1 cm
  • Thin layer deposits from 100 nm
  • Many inks and substrates
  • Ink viscosity range from 1-1000 cP
  • Nano material deposition
  • Planar and Non-Planar Capabilities
  • Low Temperature Processing
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Aerosol Jet 300 SERIES SYSTEMS

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Aerosol Jet Micro Dispense Systems are targeted at addressing new product development and low volume batch production requirements for Semiconductor Packaging applications such as die & component attach, underfill and component encapsulation, and 3D interconnects which require feature sizes as small as 10 microns to millimeters. A number of Aerosol Jet Dispense System configurations are available to meet your specific application requirements.

Aerosol Jet Micro Dispense Systems

Aerosol Jet Micro Dispense Systems

Optional Features

  • 700 mW Laser
  • UV Cure Systems

Standard Features

  • AJMD 300 – Work area 300mm x 300mm
  • AJMD 470 – Work area 470mm X 370mm
  • +/-6 microns accuracy, +/- 2 microns repeatability XY motion
  • Atomizers: 1 Ultrasonic & 1 Pneumatic
  • Dual Atomizer Deposition Control Systems
  • Interchangeable Fine and Wide Feature
  • Deposition Head with Shutters
  • Heated Platen
  • Stainless Steel Cabinet with Granite Table
  • Safety Enclosure (CE)
  • Advanced vision and lighting controls
  • Programmable dispense recipes

Applications

Batch platform for R&D and low-volume manufacturing of electronic circuitry and components. Example applications include:

  • Component / Die Attach
  • Component Underfill and Encapsulation
  • 3D Interconnects for Stacked Die & Other
  • Complex Packaging Applications
  • Embedded Passives
  • Small Footprint Packaging
  • Repair & Re-Work of Production Defects
  • Cost Effective Low Volume Manufacturing

Capabilities

  • Fine Feature sizes to 10 um
  • Wide Features Sizes to 1 cm
  • Thin layer deposits from 100 nm
  • Many inks and substrates
  • Ink viscosity range from 1-1000 cP
  • Metal, epoxy and other material depositions
  • Planar and Non-Planar Capabilities
  • Low Temperature Processing
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AEROSOL JET MICRO DISPENSE 300/470 SYSTEMS

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The Aerosol Jet Print Engine is ideally suited for rapid integration into industrial automation platforms for high performance material deposition applications. Multi-nozzle print head configurations can be designed to meet specific end user application and throughput requirements. The Aerosol Jet Print Engine includes deposition hardware, software interface, and process control systems required to implement a complete production material deposition solution. Optomec Aerosol Jet experts are available to assist in the integration and tuning of the system to meet end user requirements.

Aerosol Jet Print Engine
Print_Engine_Picture

Standard Features

  • Logic Control Unit
  • Process Control Module(s)
  • Multi-nozzle Material Deposition Head
  • Automation Interface Module
  • CE Compliant
  • Run up to 4 Print Modules Simultaneously

Applications

  • 3D antennas for mobile devices
  • Solar cell front side metallization
  • 3D Interconnects for Multi-chip Packages
  • Bridge/jumper circuits for touch screen displays
  • LCD Line open repair

Capabilities

  • Easy Integration into automation platforms
  • Industry Standard Communication Interface protocols
  • Easy to disassemble print components for periodic cleaning
  • High reliability and uptime
  • Low operating cost – no consumables
  • Process diagnostic capabilities
  • Process monitoring and data collection interface
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AEROSOL JET MID PRINT ENGINE

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Optomec’s patented Aerosol Jet printing system reduces the size of electronic systems by using nano-materials to produce fine feature circuitry, embedded components and miniaturized devices. It offers cost, size and functional advantages, including an ability to produce electronic features that are 10 -100 times smaller than competing methods such as screen-printing, inkjet industrial printing and thick film lithography. These advantages prove to be the key differentiator for Optomec’s Aerosol Jet printing in comparison to competing solutions, such as ink jet and wire bonding, as well as through silicon via (TSV) technology.
Sunanda Jayanth, Frost & Sullivan