M³D systems have the unique ability to produce a wide range of electronic, structural and biological patterns onto almost any substrate. The proprietary process utilizes aerodynamic focusing to precisely deliver fluid and nano-material formulations that as required can be optionally post-treated with a highly focused laser. The resulting functional circuits can have line widths and pattern features down from less than 10 microns to more than 150 microns, with layer thicknesses from 10's of nanometers to several microns.

The advantages of M³D include:

• CAD-driven input
• Low-temperature processing
• 3-dimensional, non-planar surfaces
• High aspect ratio structures
• Conducting and insulating materials
• Non-destructive handling of biologics
• Reduced environmental impact

The M³D process begins with a mist generator that atomizes a source material. Particles in the resulting aerosol stream can then be refined in a virtual impactor and further treated on the fly to provide optimum process flexibility.

The material stream is then aerodynamically focused using a flow guidance deposition head, which creates an annular flow of sheath gas to collimate the aerosol. The co-axial flow exits the flow guidance head through a nozzle directed at the substrate, which serves to focus the material stream to as small as a tenth of the size of the nozzle orifice (typically 100µm). Patterning is accomplished by attaching the substrate to a computer-controlled platen, or by translating the flow guidance head while the substrate position remains fixed. The relatively large (>5mm) standoff distance from the deposition head to the substrate allows accurate deposition on non-planar substrates, over existing structures, and into channels or vias.

Once deposited, the materials may undergo a thermal or chemical post-treatment to attain final electrical and mechanical properties and adhesion to the substrate. M³D can locally process the deposition using a laser treatment process that permits the use of substrate materials with very low temperature tolerances, such as polymers. The end result is a high-quality thin film (as fine as 10nm) with excellent edge definition and near-bulk properties.

Optomec holds numerous patents and has many patents pending on its proprietary M³D process and equipment.

Development history

Optomec initially developed the M³D technology under a $9 million DARPA program that sought out a comprehensive, flexible microelectronics manufacturing platform. Subsequent to that effort, Optomec worked closely with industry to better understand the applications for the technology and the requirements for a commercial system, which Optomec first released in 2004. Since its introduction, Optomec has sold M³D systems to many marquee industrial and academic organizations, and continues to work closely with these customers to further the capabilities of the system for specific end-user applications.

Material Support

The M³D deposition process supports a broad range of commercially available materials, as well as custom formulations, which are fed to the system in the form of either molecular precursors or particulate suspensions.

A wide range of materials has been successfully deposited, including diluted thick film pastes, thermosetting polymers such as UV-curable epoxies, and solvent-based polymers like polyurethane and polyimide. A combination of chemistry and post-treatment allows functional electronic structures to be fabricated directly on low temperature substrates. Conductor inks including Ag, Pt, Pd, and Cu have been developed with cure temperatures down to 150 C° , and higher temperature ceramics, ruthenates, and ferrites are cured using proprietary laser treatment.

Finally, the M³D process has also proven suitable to the deposition of biomaterials, having shown the ability to deliver even living cells without harm.