M3D is an additive manufacturing solution that reduces the overall size of electronic systems by using nanomaterials to produce fine feature circuitry and embedded components without the use of masks or patterns. The resulting functional electronics can have line widths and pattern features as small as 10 microns, and as large as 100 microns or more — successfully bridging the gap between existing screen-printing and thin-film lithography capabilities.
Optomec's M3D systems are used in the development and fabrication of next generation microelectronic devices. The system can also be used to repair production defects and legacy electronics, and further has the flexibility to be used for life science and biomedical applications.
Printable Electronics
Printed Circuit Boards
M3D systems can "direct write" high density traces and interconnects in materials such as copper, silver and gold with line widths down to 10 microns, nearly an order of magnitude smaller than traditional screen-printing. The system can optionally be used to deposit photo-resist or copper seed layers for integration with existing solutions.
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Embedded Passives and Components
M3D produces high tolerance embedded passives on both rigid and flex substrates without the need for laser trimming. M3D can also be used to "embed" other components, such as sensors, filters, and antennae, for circuit board, System-on-Chip and System-in-Package applications.
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Flex Circuits
Low temperature processing and excellent adhesion make M3D an ideal solution for flexible substrates.
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Semiconductor Packaging
M3D enables advanced HDI applications such as flip-chip and chip-scale packaging, and direct die attach.
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Life Sciences Manufacturing
The M
3D system can also produce biocompatible electronics, and is adept at the deposition of biomaterials, enabling many life sciences applications, in areas such as diagnostics, drug delivery and drug discovery.
