Optomec Blog2019-05-24T21:39:27+00:00

OPTOMEC BLOG

804, 2019

Printed Interconnects vs. Bond Wires for RF Circuits

By |April 8th, 2019|

The Challenge: Can Printed Interconnects Match the RF Performance of Bond Wires for Microwave Interconnects? The shortcomings of round bond wires for RF applications are well-known to RF designers. From a performance standpoint, the high and inconsistent loop heights of bond wires can be a detriment to low-loss coupling, especially with increasing circuit frequencies.  Likewise, from a reliability standpoint, bond [...]

1203, 2019

Directed Energy Deposition for Repair of Industrial Components: How 3D Metal Printing Saves Time and Lowers Costs

By |March 12th, 2019|

Additive manufacturing is being more broadly adopted in industrial applications – not only for producing new metal parts but also for repair and replacement of existing parts. Billions of dollars are spent in the U.S. annually to repair or replace metal parts due to corrosion or wear. Approximately one-third of these costs could be reduced by broader application of metal [...]