Optomec Solution for 3D Interconnect Applications to be featured at iMAPS 44th International Symposium on Microelectronics Technologies

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Optomec Solution for 3D Interconnect Applications to be featured at iMAPS 44th International Symposium on Microelectronics Technologies

Presentation to Highlight Aerosol Jet Printer as an Alternative to Wire Bond and TSV Technology for High Performance Multi-Chip Packaging

Albuquerque, New Mexico, 12 October 2011: Optomec announced today that Ken Vartanian, Optomec Marketing Director, will give a presentation titled “Aerosol Jet Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications” at the iMAPS 44th International Symposium on Microelectronics. The symposium will be held from October 9-13 at the Long Beach Convention Center in Long Beach, CA. For detailed information on the conference go to: http://www.imaps.org/imaps2011/index.htm

The Symposium is organized by the International Microelectronics And Packaging Society (IMAPS). IMAPS 2011 will feature technical tracks on 3D Packaging; Modeling, Design & Reliability; Next Generation Materials; Assembly & Packaging; Advanced Technologies; and a Focus Track on Advanced Packaging & System-Integration. Sessions include: 3D-TSV Processes & Materials; 3D TSV Interposers; 3D Packaging/Applications; Signal & Power Integrity; Package Reliability; Microwave/RF; Advanced Materials; Ceramic & LTCC; Thermal Management; Wire Bonding; Printed Electronics; Substrate Materials for Semicon/Solar; MEMS Packaging; and many more.

Mr. Vartanian’s presentation will discuss how Optomec’s Aerosol Jet 3D printing technology coupled with Vertical Circuits’ Vertical Interconnect Pillar (ViPtm) process can bridge the gap between wire bonders and Through Silicon Via technology for SiP interconnect applications. The Aerosol Jet/ViP process has been designed to integrate easily into current Back-End Manufacturing processes and into commercial high volume automation platforms. Aerosol Jet Systems’ fine line printing capabilities enable significant pitch reductions, thereby increasing interconnect densities and affording greater semiconductor packaging functionality at a competitive cost with wire bonding and at a fraction of the cost of TSV technology. Mr. Vartanian will explain how the non-contact Aerosol Jet process produces conformal interconnects on thinned stacked dies with reduced noise for high performance SiP applications. With its ability to use off-the-shelf materials and print in normal atmospheric conditions, equipment and maintenance costs are greatly reduced. The Aerosol Jet solution is a multi-function platform that is poised to enable high density interconnects for a range of advanced three-dimensional semiconductor packaging applications.

Optomec is the world-leading provider of additive manufacturing solutions for high-performance applications in the Electronics, Solar, Medical, and Aerospace & Defense markets. These systems utilize Optomec’s patented Aerosol Jet Printed Electronics technology and LENS powder-metal fabrication technology. The company has a global customer base of more than 100 users that includes many industry-leading manufacturers.

By | 2017-01-22T19:20:23+00:00 October 12th, 2011|
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