Printing Electronics onto Mechanical Structures Enables Novel Packaging Alternatives
Albuquerque, New Mexico, 27 June 2012:Optomec announced today that the company will showcase Aerosol Jet 3D printed electronics for novel semiconductor packaging and other applications at the SEMICON West Conference and Tradeshow. SEMICON West will be held July 10-12 at the Moscone Center in San Francisco, California.
Optomec’s exhibit booth (#6665 in the North Hall, Test, Assembly and Packaging Area) will feature demonstrations of a number of industrial devices with 3D printed electronics including; an automotive tank with fill level sensor and control circuitry (courtesy of Neotech Services MTP); a multi-chip package with fine line conformal interconnects; and aircraft components with printed antennae, sensors, and power distribution circuitry. The ability to print electronic components and interconnects directly onto complex-shaped structures enables reduced size, lighter weight and higher performance end products.
Optomec will also showcase a new conductive epoxy (developed by Resin Design) that was specifically developed for use with the Aerosol Jet printing process and its fine-feature capabilities. Together, this novel material and the Aerosol Jet system can be used to produce high-conductivity adhesive features for surface mount, and high-stress interconnect applications.
The unique ability of Aerosol Jet technology to print a wide variety of electronic materials directly onto a wide variety on non-planar surfaces makes it an ideal solution for many packaging applications. Aerosol Jet produces a high velocity material mist stream enabling the system to print interconnects, for example on vertically stacked dies, without adjustment to Z-height positioning. The system can print fine features to <10 microns or wide features > 1 centimeter making it ideal for both microelectronic and coating applications. Multiple print heads can be independently controlled by the Aerosol Jet system and each print head can have multiple nozzles providing a high degree of system scalability to meet application throughput requirements.
Optomec is the world-leading provider of additive manufacturing solutions for high-performance applications in the Electronics, Solar, Medical, and Aerospace & Defense markets. These systems utilize Optomec’s patented Aerosol Jet Printed Electronics technology and LENS powder-metal fabrication technology. The company has a global customer base of more than 100 users that includes many industry-leading manufacturers.
Aerosol Jet is a registered trademark of Optomec, Inc.
LENS is a trademark of Sandia Laboratories.