Highlights Aerosol Jet Printing of Fine Pitch Interconnects for Stacked Die
Albuquerque, New Mexico, 2 November 2010: Optomec announced today that Chip Scale Review Magazine published an article entitled “Jetting Your Way to Fine-pitch 3D Interconnects” in their Sept/Oct 2010 issue. The article discusses how fine line 3D interconnects can be printed on multi-function stacked die using the Aerosol Jet process. System in Packages (SiP) produced through this process pack more functionality into a smaller footprint which is ideal for mobile devices such as Smartphones and Tablets. As more chips are stacked into a SiP, the required number and density of printed interconnects increases creating challenges for traditional methods such as wire bonding. The article explains how Optomec and Vertical Circuits have partnered to develop a viable production solution that solves this problem. High initial yields with robust electrical performance have been demonstrated using the Aerosol Jet process, and customer devices are currently undergoing the final stages of reliability testing.
Mike O’Reilly, Aerosol Jet Product Manager states “In the semiconductor packaging industry, 3D printed interconnects can provide real cost and functional benefits for the production of multi-chip stacked die in System in Pakage (SiP) applications. Aerosol Jet’s fine line printing capabilities enable significant pitch reductions, thereby increasing interconnect densities and affording greater semiconductor packaging functionality at a fraction of the cost of TSV technology. Aerosol Jet’s ability to use off-the-shelf materials and print in normal atmospheric conditions greatly reduces equipment and maintenance costs.”
Optomec is the world-leading provider of additive manufacturing solutions for high-performance applications in the Electronics, Solar, Medical, and Aerospace & Defense markets. These systems utilize Optomec’s patented Aerosol Jet Printed Electronics technology and LENS powder-metal fabrication technology. The company has a global customer base of more than 100 users that includes many industry-leading manufacturers.