Presentation to Highlight Alternative to Wire Bond and TSV for 3D Interconnect Applications
Albuquerque, New Mexico, 8 March 2011: Optomec announced today that Mike O’Reilly, Optomec’s Aerosol Jet Product Manager, will give a presentation titled “Aerosol Jet Printing as an Alternative to Wire Bond and Through Silicon Via Technology for 3D Interconnect Applications” at the IMAPS (International Microelectronics and Packaging Society) Device Packaging Conference on March 9. The conference will be held from March 8-10th at the Radisson Fort McDowell Resort and Casino in Scottsdale/Fountain Hills, Arizona. For detailed information on the conference go to http://www.imaps.org/programs/devicepackaging2011.htm.
The seventh Annual Device Packaging Conference is an international event and attracts a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. The conference provides a focused forum on the latest technological developments in five topical workshop areas related to microelectronic packaging, including 3D Interconnect packaging, Flip Chip Technologies, MEMS & Associated Microsystems, Wafer Level Packaging; and Emerging Technologies (LEDs & Passive Integration.
Mr. O’Reilly’s presentation will discuss how, based on cost and functional advantages, the Aerosol Jet process is emerging as an effective alternative to traditional wire bond and through-silicon-via (TSV) technologies. Aerosol Jet systems have high density 3-dimensional interconnect capabilities which enable multi-functional integrated circuits to be stacked and vertically interconnected in high performance System-in-Package (SiP) solutions. The die stacks can include 8 or more die, with a total stack height of ~ 1 mm. The printing system has a working distance of several mm which means that no Z-height adjustments are required for the interconnect printing. Closely coupled pneumatic atomizers with multiplexed print nozzles are used to achieve production throughput of greater than >18,000 interconnects per hour, and high aspect ratio interconnects with 30-micron line width and 6-micron line heights have been demonstrated at sub 60-micron pitches with low resistivity. The presentation will also include pre-production qualification results, final production packaging, and further definition of the Aerosol Jet print platform integrated within a high throughput, manufacturing ready automation solution.
Optomec is the world-leading provider of additive manufacturing solutions for high-performance applications in the Electronics, Solar, Medical, and Aerospace & Defense markets. These systems utilize Optomec’s patented Aerosol Jet Printed Electronics technology and LENS powder-metal fabrication technology. The company has a global customer base of more than 100 users that includes many industry-leading manufacturers.