Presentations to Highlight Aerosol Jet Systems for High Resolution Conformal Printing, Direct Circuit Board Printing and Printed Flexible Circuits
Albuquerque, New Mexico, 3 October 2011: Optomec announced today that Jason Paulsen and Dr. Kurt Christenson will give presentations on “High Resolution Conformal Printing with Aerosol Jet” and “Direct Printing of Circuit Boards Using Aerosol Jet”, respectively. The conference is being held from held from October 2-6 in Minnealpolis, MN. For detailed information on the conference go to: http://www.imaging.org/IST/conferences/nip/
For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. The conference includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.
Mr. Paulsen’s poster presentation will explain the Aerosol Jet printing process and discuss how the deposited features can be as small as 10 um. A wide assortment of materials can be printed, such as metal nanoparticles, polymers, adhesives, ceramics, and bio-active materials. He will explain how the nozzle direction and XYZ positioning is controlled by CAD/CAM software which allows conformal printing onto 2.5D substrates which have a high level of surface topography, as well as fully 3D surfaces. Mr. Paulsen will discuss the fabrication of a conformal phase array antenna, embedded circuitry and sensors, and electronic packaging. For more information on Aerosol Jet systems, click here.
Dr. Christenson’s presentation, titled “Direct Printing of Circuit Boards Using Aerosol Jet” will discuss how direct printing with Aerosol Jet can replace many of the traditional manufacturing steps and consequently allow circuits to be fabricated on novel substrates and 3D geometries. Printed Circuit boards (PCBs) are traditionally fabricated using subtractive technologies such as lithography and etching. Discrete passive and active components are typically attached by pick and place and then connected using wire bonding and soldering. Dr. Christensen will specifically, report on the integration of Aerosol Jet with the printing of interconnects, passives and COTS attachment.
In addition to Mr. Paulsen and Dr. Christensons’ presentations, Mingjing Ha (University of Minnesota) will present a poster presentation titled “Low Voltage, Printed, Flexible Circuits for Display and Memory”. The Aerosol Jet system was used to print the circuits that will be discussed in her presentation.
Optomec is the world-leading provider of additive manufacturing solutions for high-performance applications in the Electronics, Solar, Medical, and Aerospace & Defense markets. These systems utilize Optomec’s patented Aerosol Jet Printed Electronics technology and LENS powder-metal fabrication technology. The company has a global customer base of more than 100 users that includes many industry-leading manufacturers.