Semiconductor Packaging

Semiconductor Packaging 2017-04-18T19:32:40+00:00

Semiconductor Packaging

Semiconductor Packaging

Print die & component attach, underfill and component encapsulation, and 3D interconnects which require feature sizes as small as 10 microns to millimeters.

SemiconductorPCB

  • Features sizes ranging from ~10 microns to millimeters
  • Dispensing support for wide variety of inks / materials
  • Repeatable recipe driven dispense
  • Planar and non-planar Capabilities
  • Advanced vision and lighting control
  • Low Temperature Processing
  • CAD import eases toolpath generation

3D Interconnects

For Stacked Die & Other Complex Packaging Applications

Aerosol Jet’s high-velocity dense mist stream enables the system to print vertically along the terraced steps of stacked dies without adjustment of Z-height positioning for eight to sixteen SiP die stacks. Typical 3D interconnects are 25 to 30 microns wide by 5+ microns in height. Total length of each interconnect is approximately 1.5 mm long with throughput for a single nozzle reaching up to 5,000 interconnects per hour. The Aerosol Jet print head is highly scalable supporting 2 or more nozzles at a time, pitch dependent, enabling 10,000 plus interconnects per hour. The solution is capable of extended print run times of four hours or more before ink refill is required.

 

Printing 3D interconnects on stacked die

Embedded Passives on Rigid & Flex Substrates

Aerosol Jet systems reliably produce ultra-fine feature circuitry well beyond the capabilities of thick-film and ink-jet processes. Most materials can be written with a resolution of down to 20 microns. For Ag, electronic features as small as 10 microns with a 20 micron pitch can be written. This capability offers a solution for the production of smaller, high performance components critical to size-sensitive applications like those in the wireless and hand-held device markets where component density is increasing dramatically.

 

Printed Resistors

The ability of the Aerosol Jet technology to create fine features with complex geometries in 3D from a wide range of materials makes it suitable for the production of both passive and active components, including resistors, inductors, capacitors, filters, micro-antennae, micro-batteries, and sensors. The precise edge definition and repeatability of the process are particularly relevant to high-frequency requirements. In comparison to screen-printing, embedded resistors can be made smaller and more accurately with the Aerosol Jet process, such that no laser-trimming is needed to tune the resistor to the right value.

Component / Die Attach Applications

As electronic component functionality increases and overall product package size decreases current dispense solutions are not keeping pace with manufacturing needs. With surface mount components as small as 0.60 mm X 0.30 mm and industry standard needle and jet dispense dot sizes >0.15 mm, electrical shorting and time consuming material rework have become the norm for manufacturers driven by smaller product package sizes. The Aerosol Jet Series takes dispense functionality to a whole new level with its ability to dispense materials, such as conductive epoxies, with dot sizes as small as 50 microns. Aerosol Jet systems come equipped with a variety of print head options that enable feature sizes from 10 microns to millimeters in a single pass providing ultimate flexibility in meeting your dispense requirements.

Component Underfill and Encapsulation

As component die and package size shrink with component-to-component spacing of 0.2 mm and requirements to be within 0.1 mm of the substrate surface, current dispense technologies are inhibiting manufacturers’ ability to move to these new technologies.With capability of dispensing material such as epoxy to feature sizes of 50 microns, Aerosol Jet technology is capable of meeting today’s and tomorrow’s electronic packaging requirements. Aerosol Jet printer’s continuous flow operation insures consistent material output over run times of 4 or more hours. With its built in shuttering capabilities excess material can be captured and recycled for future use. Couple these capabilities with the printer’s ability to dispense precise thicknesses of materials for Underfill or Encapsulation applications, Optomec is leading the way in developing a new generation of environmentally friendly production solutions.

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