Aerosol Jet Fine Feature Printed Electronics 3D Semiconductor Packaging Solution Webinar2018-04-19T20:03:14+00:00

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Aerosol Jet Fine Feature Printed Electronics 3D Semiconductor Packaging Solution

Overview

This webinar describes cost and functional advantages of Aerosol Jet printed 3D interconnects for semiconductor packaging. The presentation will include information on the scale-up of Aerosol Jet printing equipment to meet high volume production requirements, how the printing process integrates into current manufacturing processes, and reliability and test results for initial semiconductor devices produced through the process.

Duration: 22 minutes

About the Presenter:

Dave RamahiDave Ramahi is President and CEO at Optomec since 2002 where has focused the Company towards development and implementation of production grade 3D printing solutions. Mr. Ramahi received his B.S. in Mechanical Engineering from the Massachusetts Institute of Technology.

Aerosol Jet Fine Feature Printed Electronics 3D Semiconductor Packaging Solution