Aerosol Jet® Printing of High Density, 3-D Interconnects for Multi-Chip Packaging2018-05-01T17:47:33+00:00

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Aerosol Jet® Printing of High Density, 3-D Interconnects for Multi-Chip Packaging

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[Download] Aerosol Jet® Printing of High Density, 3-D Interconnects for Multi-Chip Packaging

While the functionality of application-specific handheld mobile devices converge into single multipurpose products, consumers continue to demand ever decreasing product footprints and lighter weight devices.