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Aerosol Jet Fine Feature Printed Electronics 3D Semiconductor Packaging Solution

Overview:

Jet Fine Feature Printed

This webinar describes cost and functional advantages of Aerosol Jet printed 3D interconnects for semiconductor packaging. The presentation will include information on the scale-up of Aerosol Jet printing equipment to meet high volume production requirements, integration into current manufacturing processes, and initial examples and results.

Webinar: